![]() Lithographic apparatus with pre-formed flexible transportation line.
专利摘要:
公开号:NL1036163A1 申请号:NL1036163 申请日:2008-11-06 公开日:2009-06-02 发明作者:Marcus Martinus Petrrus Vermeulen;Henrikus Herman Marie Cox;Godfried Katharina Hubertus Geelen;Jer Me Francois Sylvain Virgile Loo 申请人:Asml Netherlands Bv; IPC主号:
专利说明:
LITHOGRAPHIC APPARATUS WITH PRE-FORMED FLEXIBLE TRANSPORTATION LINE BACKGROUND Field of the Invention The present invention relates to a lithographic apparatus with a pre-formed flexible transportation line and to an apparatus in general having such a pre-formed flexible transportation line. Description of the Related Art A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on an individual layer of the IC. This pattern can be transferred onto a target portion (e.g., including part of, one, or several dies) on a substrate (e.g., a silicon wafer). Transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. Conventional lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion at once, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a given direction (the "scanning" direction) while synchronously scanning the substrate parallel or anti-parallel to this direction. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate. In a substrate table and / or patterning device support of current lithographic apparatus, a so-called short-stroke part is dynamically coupled to a so-called long-stroke part by hoses and wires to transport, e.g. cooling medium and electrical power. The stiffness and damping of the hoses and wires between the short stroke part and the long stroke part act as a parasite and cause position errors. This has a negative influence on the general performance of the apparatus. In particular the parasitic stiflhess and damping of the hoses and wires is: 1) inhomogeneous for different directions (x, y, z); 2) variable in time due to changing material properties due to heat up; and 3) relatively large in magnitude, causing relatively large errors. Due to the first two reasons, feed forward compensation or disturbance forces due to the parasitic stiffness and damping is only possible to a small extent (especially damping), leaving a large disturbance error. In addition, this error is direction dependent. By using two-dimensionally pre-formed hoses and wires with small diameter and applying highly elastic materials, this effect can be reduced. However, demands on the lithographic process are growing and further improvements are desired. SUMMARY It is desirable to at least partly overcome the abovementioned disadvantages or to provide a useable alternative. In particular the present invention aims to provide reduced parasitic stiffness and damping or dynamic couplings with transportation lines between moveable parts or an apparatus in general or a lithographic apparatus specifically. According to an embodiment of the invention, there is provided a lithographic apparatus including: - an illumination system configured to condition a radiation beam; - a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; - a substrate table constructed to hold a substrate; and - a projection system configured to project the patterned radiation beam onto a target portion of the substrate, in which a flexible transportation line is provided extending between a first and second part of the apparatus which parts are moveable with respect to each other, said line is pre-formed in a three-dimensional curve. In another embodiment of the invention, there is provided a lithographic apparatus including: - an illumination system configured to condition a radiation beam; - a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; - a substrate table constructed to hold a substrate; and - a projection system configured to project the patterned radiation beam onto a target portion of the substrate, in which a first and second flexible transportation line is provided extending between a first and second part of the apparatus which parts are moveable with respect to each other said said lines are each pre-formed in at least a two-dimensional curve, in which said pre-formed curves or said first and second lines have mirrored orientations with respect to each other. According to a further embodiment of the invention, there is provided an apparatus including: a flexible transportation line extending between a first and second part of the apparatus which parts are moveable with respect to each other, said said line is pre-formed in a three -dimensional curve. According to a still further embodiment of the invention, there is provided an apparatus including: a first and second flexible transportation line extending between a first and second part of the apparatus which parts are moveable with respect to each other, said said lines are each pre -formed in at least a two-dimensional curve, in which said pre-formed curves or said first and second lines have mirrored orientations with respect to each other. LETTER DESCRIPTION OF THE DRAWINGS Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which: Figure 1 depicts a lithographic apparatus according to an embodiment of the invention; Figure 2 shows an embodiment of a dynamic coupling with two sets of 3D-curved tubes with mirrored orientation between two modules of the apparatus in Figure 1; Figure 3 shows the direction dependent stiffness or one of the 3D-curved tubes or Figure 2; Figure 4 shows the direction dependent stiffness of a 2D-curved tube; Figure 5 shows the direction dependent stiffness of two of the 3D-curved tubes or figure 2 with similar orientation; Figure 6 shows the direction dependent stiffness of two of the 3D-curved tubes or figure 2 with mirrored orientation; Figure 7 shows a variant of Figure 2 with two sets of 2D-curved tubes with mirrored orientation between the two modules of the apparatus in Figure 1; Figure 8 shows the direction dependent stiffness of two of the 2D-curved tubes or figure 7 with similar orientation; and Figure 9 shows the direction dependent stiffness of two of the 2D-curved tubes or figure 7 with mirrored orientation. DETAILED DESCRIPTION Figure 1 schematically depicts a lithographic apparatus according to one embodiment of the invention. The apparatus includes an illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation or any other suitable radiation), a mask support structure (eg a mask table) MT constructed to support a patterning device (eg a mask) MA and connected to a first positioning device PM configured to accurately position the patterning device in accordance with certain parameters. The apparatus also includes a substrate table (eg a wafer table) WT or "substrate support" constructed to hold a substrate (eg a resist-coated wafer) W and connected to a second positioning device PW configured to accurately position the substrate in accordance with certain parameters. The apparatus further includes a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. including one or more dies) or the substrate W. The illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination of, for directing, shaping, or controlling radiation. The mask support structure supports, i.e. bears the weight of, the patterning device. It holds the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is a hero in a vacuum environment. The mask support structure can use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The mask support structure may be a frame or a table, for example, which may be fixed or movable as required. The mask support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system. Any use of the terms "reticle" or "mask" may be considered synonymous with the more general term "patterning device." The term "patterning device" used should be broadly interpreted as referring to any device that can be used to impart a radiation beam with a pattern in its cross-section so as to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit. The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmable LCD panels. Masks are well known in lithography, and include mask types such as binary, alternating phase shift, and attenuated phase shift, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted so as to reflect an incoming radiation beam in different directions. The tilted mirrors impart a pattern in a radiation beam which is reflected by the mirror matrix. The term "projection system" used should be broadly interpreted as encompassing any type of projection system, including refractive, reflective, catadioptric, magnetic, electromagnetic and electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term "projection lens" may also be considered as synonymous with the more general term "projection system". As here depicted, the apparatus is of a transmissive type (e.g., employing a transmissive mask). Alternatively, the apparatus may be of a reflective type (e.g., employing a programmable mirror array or a type referred to above, or employing a reflective mask). The lithographic apparatus may be of a type having two (dual stage) or more substrate tables or "substrate supports" (and / or two or more mask tables or "mask supports"). In such "multiple stage" machines the additional tables or supports may be used in parallel, or preparatory steps may be carried out on one or more tables or supports while one or more other tables or supports are being used for exposure. The lithographic apparatus may also be a type of at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g., water, so as to fill a space between the projection system and the substrate. Liquid immersion may also be applied to other spaces in the lithographic apparatus, for example, between the mask and the projection system. Immersion techniques can be used to increase the numerical aperture of projection systems. The term "immersion" as used does not mean that a structure, such as a substrate, must be submerged in liquid, but rather only means that a liquid is located between the projection system and the substrate during exposure. Referring to figure 1, the illuminator IL receives a radiation beam from a radiation source SO. The source and the lithographic apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source is not considered to be part of the lithographic apparatus and the radiation beam is passed from the source SO to the illuminator IL with the aid of a beam delivery system BD including, for example, suitable directing mirrors and / or a beam expander. In other cases the source may be an integral part of the lithographic apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system. The illuminator IL may include an adjuster AD configured to adjust the angular intensity distribution of the radiation beam. Generally, at least the outer and / or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) or the intensity distribution in a pupil plane or the illuminator can be adjusted. In addition, the illuminator IL may include various other components, such as an integrator IN and a condenser CO. The illuminator may be used to condition the radiation beam, to have a desired uniformity and intensity distribution in its cross-section. The radiation beam B is an incident on the patterning device (e.g., mask MA), which is a hero on the mask support structure (e.g., mask table MT), and is patterned by the patterning device. Having traversed the mask MA, the radiation beam B passes through the projection system PS, which is the beam onto a target portion C or the substrate W. With the aid of the second positioning device PW and position sensor IF (eg an interferometric device, linear encoder or capacitive sensor), the substrate table WT can be moved accurately, eg so as to position different target portions C in the path of the radiation beam B. Similarly, the first positioning device PM and another position sensor (which is not explicitly depicted in Figure 1) can be used to accurately position the mask MA with respect to the path of the radiation beam B, eg after mechanical retrieval from a mask library, or during a scan. In general, movement of the mask table MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioning device PM. Similarly, movement of the substrate table WT or "substrate support" may be realized using a long-stroke module and a short-stroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner) the mask table MT may be connected to a short-stroke actuator only, or may be fixed. Mask MA and substrate May be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one that is provided on the mask MA, the mask alignment marks may be located between the dies. The depicted apparatus could be used in at least one of the following modes: 1. In step mode, the mask table MT or "mask support" and the substrate table WT or "substrate support" are kept essentially stationary, while an entire pattern imparted to the radiation beam is projected onto a target portion C at one time (ie a single static exposure). The substrate table WT or "substrate support" is then shifted in the X and / or Y direction so that a different target portion can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure. 2. In scan mode, the mask table MT or "mask support" and the substrate table WT or "substrate support" are scanned synchronously while a pattern is imparted to the radiation beam is projected onto a target portion C (ie a single dynamic exposure) . The velocity and direction of the substrate table WT or "substrate support" relative to the mask table MT or "mask support" may be determined by the (de-) magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) or the target portion in a single dynamic exposure, whereas the length of the scanning motion has the height (in the scanning direction) of the target portion. 3. In another mode, the mask table MT or "mask support" is kept essentially stationary holding a programmable patterning device, and the substrate table WT or "substrate support" is moved or scanned while a pattern is projected onto the radiation beam a target portion C. In this mode, generally a pulsed radiation source is employed and the programmable patterning device is updated as required after each movement of the substrate table WT or "substrate support" or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array or a type as referred to above. Combinations and / or variations on the modes described above or use or entirely different modes or use may also be employed. In figure 2 the substrate table WT is shown as having a first lower part, here formed by a so-called long-stroke module, and a second upper part, here formed by a so-called short-stroke module, SS. The two modules LoS and SS are moveable with respect to each other, and are moveably connected with each other by means of a dynamic chain of supplies 1 including several flexible transportation lines 2. The transportation lines 2 may for example be formed by hoses for transporting a medium, like a cooling liquid, and / or wires for transporting electricity between the two modules LoS and SS. According to an aspect of the present invention the transportation lines 2 are each pre-formed in a three-dimensional curve. With the definition "pre-formed in a three-dimensional curve" it is being meant that the supply line itself is pre-formed in such a way that it is to remain its specific shape if it is not loaded and / or substantially free of internal tensions, that is to say if it is substantially undistorted. In figure 2 two sets of transportation lines 2 are present which are positioned in such a way that they have mirrored orientations with respect to each other. Each individual line 2 comprises a first, second and third leg 3a, 3b, 3c each extending in different directions and together covering the three dimensions. In the embodiment shown in figure 2 the legs 3a, 3b, 3c extend in directions orthogonal with respect to each other. Between the legs 3a, 3b, 3c pre-formed bends 4a, 4b are present. Each bend 4a, 4b covers an angle or substantially 90 degrees. By applying three-dimensionally pre-formed lines in pairs with mirrored orientation, a substantial reduction of disturbance forces (in magnitude and variation) between the two modules LoS and SS can be gained during movement of the modules with respect to each other. The lines 2 have appeared to have a reduced parasitic stiffness and damping mainly thanks to their individual three-dimensional pre-curved shape, and subsidiary because of their mirrored orientation in pairs. This large impact of these advantages becomes more clear when looking at figures 3-6. The stiffness of one of the three-dimensionally pre-formed lines 2 with equal length of its legs 3a, 3b, 3c as a function of the direction (from 0 to 360 deg) is given in figure 3. For damping a similar effect applies with different magnitude. Figure 4 shows the stiffness for a two-dimensionally pre-formed line 7 with two orthogonal legs 8a, 8b connected with each other by means of a pre-formed bend 9. The legs and the bend have been given the same cross section and length as those of figure 3. Comparison of figure 3 and 4 shows that with the three-dimensionally pre-formed line 2, the maximum value of the stiffness has decreased drastically to about 10 N / m, instead of 200 N / m for the two-dimensionally pre-formed line 7. Also the relative variation of figure 3 has reduced to about 35% instead of 90% for the two-dimensionally pre-formed line 7. The advantage of mirrored orientation in pairs becomes clear from comparing figures 5 and 6. Figure 5 shows a pair of lines 2 pre-formed in similar shapes and positioned parallel to each other. Figure 6 shows a pair of lines 2 pre-formed in mirrored shapes and positioned opposite one another. Comparison of figure 5 and 6 shows that with the mirrored orientation the maximum value of the stiffness is less than 18 N / m, instead of more than 19 N / m for the parallel orientation. It is noted that such a mirrored orientation already offers large advantages for two-dimensionally pre-formed lines, like for example the line 7 as shown in figure 4. Another aspect of the present invention is therefore directed to the provision of at least two lines extending between two parts of an apparatus moveable with respect to each other and being each pre-formed in at least a two-dimensional curve, in which the pre-formed curves of the two lines have mirrored orientations with respect to each other. Figure 7 shows a variant with two sets of the two-dimensionally pre-formed lines 7 or figure 4 with mirrored orientation between the two modules LoS and SS. Figure 8 shows the direction dependent stiffness or two of the lines 7 with similar orientation, and Figure 9 shows the direction dependent stiffness or two of the lines 7 with mirrored orientation. Comparison of figure 8 and 9 shows that with the mirrored orientation, the maximum value of the stiffness has decreased drastically to about 250 N / m, instead of about 400 N / m for the parallel orientation (for certain leg length and cross section geometry) . Also the relative variation of figure 9 has reduced to about 80% instead of 90% in figure 8. The lines 7 can be built horizontally (in xy plane) or vertically (in xz or yz plane). The maximum stiffness of the mirrored lines 7 do not coincide, resulting in a smaller total maximum stiffness and a smaller variation. As a result, both the magnitude and the uncorrectable variation of the disturbing forces from parasitic stiffness (and damping) are narrower. Many different variants are possible. For example the pre-formed lines may have other curved shapes as long as the pre-formed curved shapes are three-dimensional and / or have mirrored orientations when provided in pairs. For example the pre-curved bend may also cover a somewhat larger or narrower angle. In particular the pre-curved bend may cover an angle of +/- 25 degrees with respect to said 90 degrees, leading to the angle lying between 65-115 degrees, in order to still have the benefits of the invention. If the preformed line includes legs, then the lengths of these legs do not need to be the same, but may differ from one another. For example, to have both the benefit of small disturbances from parasitic stiffness and damping or three-dimensionally pre-formed lines, as well as small disturbances from vibrations, a three-dimensionally pre-formed line with reduced length of one (or more) legs can be applied. In particular at least one of the legs may then be given a length which is less than half the length or one of the other legs. Preferably it is the upwardly rising leg which is then shortened. In practice it has appeared that this might reduce the parasitic stiffness up to 70% while the first natural frequency is less than 20% reduced with respect to a three-dimensionally pre-formed line having very long legs. Thus, depending on disturbance contributions from parasitic stiffness and damping on the one hand and that on vibrations on the other hand, the lengths of the legs can be adapted correspondingly. The transportation lines according to the invention may also be advantageously applied between other parts of a lithographic apparatus, like for example between parts of the patterning device support or the projection system. The transportation lines according to the invention may also be advantageously applied between moveable parts or another type of apparatus, where disturbance forces from parasitic stiffness and damping from dynamic hoses and wires need to be minimized. The line may be manufactured from all children of materials as long as they are able to pre-formed into a desired shape and at the same time are able to maintain a certain degree of flexibility. For example the line may be a flexible hose having an E-modulus lying between 0-200 N / mm2, in particular about 65 N / mm2. Also for example the line may be a flexible wire for transporting electricity having an E-modulus lying between 0-150-103 N / mm2. Preferably the line comprises a thermosetting plastic which has been given its pre-form in the desired three-dimensional curve in a mold under the influence of heat. With this the line can be heated in the mold and after the line has cooled or, it is pre-formed and remains its three-dimensional shape as long as it remains undistorted. Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described may have other applications, such as the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms "wafer" or " those "may be considered as synonymous with the more general terms" substrate "or" target portion ", respectively. The substrate referred to may be processed, before or after exposure, in for example a track (a tool that typically applies to a layer of resist to a substrate and develops the exposed resist), a metrology tool and / or an inspection tool. Where applicable, the disclosure may be applied to such and other substrate processing tools. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so the term substrate used may also refer to a substrate that already contains multiple processed layers. Although specific reference may have been made above to the use of the invention in the context of optical lithography, it will be appreciated that the invention may be used in other applications, for example imprint lithography, and where the context allows, is not limited to optical lithography. In imprint lithography a topography in a patterning device the pattern created on a substrate. The topography of the patterning device may be pressed into a layer or resist supplied to the substrate whereupon the resist is cured by applying electromagnetic radiation, heat, pressure or a combination thereof. The patterning device is moved out of the resist leaving a pattern in it after the resist is cured. The terms "radiation" and "beam" used include and compass all types of electromagnetic radiation, including ultraviolet (UV) radiation (eg having a wavelength of or about 365, 248, 193,157 or 126 nm) and extreme ultra-violet (EUV) radiation (eg having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams. The term "lens", where the context allows, may refer to any one or combination of various types of optical components, including refractive, reflective, magnetic, electromagnetic and electrostatic optical components. While specific expired or the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Other aspects of the invention are set out as in the following numbered clauses: 1. A lithographic apparatus including: - an illumination system configured to condition a radiation beam; - a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; - a substrate table constructed to hold a substrate; and - a projection system configured to project the patterned radiation beam onto a target portion of the substrate, in which a flexible transportation line is provided extending between a first and second part of the apparatus which parts are moveable with respect to each other, said line is pre-formed in a three-dimensional curve. 2. A lithographic apparatus according to clause 1, wherein the apparatus further comprises a second flexible transportation line extending between said first and second part of the apparatus, said second line also being pre-formed in a three-dimensional curve, in which said pre -formed curves or said first and second lines have mirrored orientations with respect to each other. 3. A lithographic apparatus according to clause 1, said said line comprises a first, second and third lay each extending in different directions of the three dimensions, between which legs pre-formed bends are present each covering an angle of between 65-115 degrees . 4. A lithographic apparatus according to clause 3, said legs extend in directions orthogonal with respect to each other, and said pre-formed bends each cover at an angle of 90 degrees. 5. A lithographic apparatus according to clause 3, at least one of the legs has a length which is less than half the length of one of the other legs. 6. A lithographic apparatus according to clause 1, the first and second part of the apparatus between which said line extends are formed by first and second parts of the substrate table, the patterning device support or the projection system. 7. A lithographic apparatus according to clause 1, said said line is a hose for transporting a medium or a wire for transporting electricity between the first and second part of the apparatus. 8. A lithographic apparatus according to clause 1, said said line comprises a thermosetting plastic which has been given its pre-form in said three-dimensional curve in a mold under the influence of heat. 9. A lithographic apparatus including: - an illumination system configured to condition a radiation beam; - a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; - a substrate table constructed to hold a substrate; and - a projection system configured to project the patterned radiation beam onto a target portion of the substrate, in which a first and second flexible transportation line is provided extending between a first and second part of the apparatus which parts are moveable with respect to each other said said lines are each pre-formed in at least a two-dimensional curve, in which said pre-formed curves or said first and second lines have mirrored orientations with respect to each other. 10. An apparatus including: a flexible transportation line extending between a first and second part of the apparatus which parts are moveable with respect to each other, said said line is pre-formed in a three-dimensional curve. 11. An apparatus according to clause 10, where the apparatus further comprises a second flexible transportation line extending between said first and second part of the apparatus, said second line also being pre-formed in a three-dimensional curve, in which said pre- formed curves or said first and second lines have mirrored orientations with respect to each other. 12. An apparatus including: a first and second flexible transportation line extending between a first and second part of the apparatus which parts are moveable with respect to each other, said lines are each pre-formed in at least a two-dimensional curve, in which said pre-formed curves or said first and second lines have mirrored orientations with respect to each other. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope or the clause set out below.
权利要求:
Claims (1) [1] A lithographic apparatus comprising: - an illumination device adapted to provide a radiation beam; - a carrier constructed to support a patterning device capable of applying a pattern in a cross-section of the radiation beam to form a patterned radiation beam; - a substrate table constructed to support a substrate; and - a projection system adapted to project the patterned radiation beam onto a target area of the substrate, the lithographic apparatus also being provided with: - a flexible transport means extending between a first and a second part of the lithographic apparatus, the parts relative to are movable from each other, and wherein said conveying means is preformed according to a 3-dimensional bend.
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同族专利:
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引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 JPH0678335A|1991-05-17|1994-03-18|Teac Corp|Picture recording and reproducing device| JP3814095B2|1999-04-05|2006-08-23|日本電子株式会社|High voltage introduction mechanism| JP2001009902A|1999-04-30|2001-01-16|Piolax Inc|Production of bent resin hose| US6583597B2|2000-07-07|2003-06-24|Nikon Corporation|Stage apparatus including non-containing gas bearings and microlithography apparatus comprising same| JP2002198284A|2000-12-25|2002-07-12|Nikon Corp|Stage device and projection aligner| JP2004273666A|2003-03-07|2004-09-30|Nikon Corp|Aligner| JP3826118B2|2003-07-08|2006-09-27|キヤノン株式会社|Exposure equipment| JP2005046941A|2003-07-31|2005-02-24|Canon Inc|Stage device with cable jogging unit|WO2013037856A1|2011-09-12|2013-03-21|Mapper Lithography Ip B.V.|Substrate processing apparatus| DE102016217285A1|2016-09-12|2018-03-15|Carl Zeiss Smt Gmbh|DEVICE FOR TRANSMITTING ELECTRICAL SIGNALS AND LITHOGRAPHIC SYSTEM|
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